A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
If you have access to 3D printer, but not the time or resources to access state-of-the-art CAD packages, you may be interested in a new tablet application called the Doodle3D Transform App. Which has ...
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